- High-Speed PCB Design
- Signal Integrity (SI) & Power Integrity (PI)
- High-Speed Interface Design - USB 2.0/3.0, HDMI, PCIe, DDR3, Ethernet/10G
- BGA Placement & High-Density Routing
- Impedance-Controlled Routing & Stack-Up Design
- Multi-Layer Rigid-Flex PCB Design - 20+ layer boards
- Length Matching & High-Speed Timing Constraints
- Mixed-Signal PCB Design - Analog, Digital, Power & RF
- PCB Footprint/Library Design & IPC Standards - IPC-7351, IPC-2221
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